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the current of escaping nitrogen. Most circuit boards with moderate thermal mass such as cell phones, PC mother boards and peripherals can be profiled successfully without bottom side forced convection
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Transient Thermal Environments Nordson ASYMTEK S. Adamson, D. Ashley, W. Hassler, J. Wilburn (IMAPS Device Packaging Conference 2009) (PDF 314 KB) 3Q 2015 NDSN Investor MASTER Nordson Corporation Large-Volume Dispensing TIM Essential Guide Nordson Corporation Optimum Systems Poster Nordson EFD Nordson EFD Optimum
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packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
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pistons feature unique channels that prevent air entrapment while providing a smooth profile radius to reduce fluid shear. Nordson EFD Thermal Interface Materials (TIM
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