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. Szuch (IMAPS SoCal 2004) (PDF 431 KB) Nordson ASYMTEK’s Tilt + Rotate Uses 5 Axes for Fluid Dispensing Nordson ASYMTEK Dispenses up sides of a component and on all 4 sides while maintaining precision, speed, and accuracy Thermal Management
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stabilize absorbent cores while retaining desired "garment-like" attributes Thermal Management: Spotlight Thermal Gap Filler Nordson ASYMTEK Plan your approach
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, including Thermal Interface Material (TIM), Potting, Gasketing and Sealing and more. Thermal Management: Spotlight Thermal Gap Filler Nordson ASYMTEK Plan your approach
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. Thermal management for proper heat control can also strongly influence cost, weight, size, and power requirements. PCB Heat Dissipation The two primary methods of removing heat from a circuit board are convection and conduction
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) Nordson ASYMTEK Demonstrates the Helios Medium- to Large-Volume Dispenser at The Battery Show and Bondexpo Nordson ASYMTEK Integrated system deposits 1K and 2K materials for electronics manufacturing Thermal Management
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Conference- Amsterdam 2017 Nordson ASYMTEK Come visit Nordson ASYMTEK at SMTA Contamination, Cleaning, and Coating Conference- Amsterdam 2017 Nordson ASYMTEK Introduces Continuous Path Motion Control Software Nordson ASYMTEK Improves dispensing speed for underfilling flip chips Thermal Management
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