Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. These standards classify moisture sensitivity levels, or MSLs, on a scale from 1 to 6 depending on their susceptibility to moisture-induced damage
40731 | https://www.smta.org/harsh/2018-Harsh-Environments-Program.pdf
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. One school of industry thought held that a void in a solder joint would be a stress riser that initiated cracks, leading to solder joint failure
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. One school of industry thought held that a void in a solder joint would be a stress riser that initiated cracks, leading to solder joint failure
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Rakesh Kumar of Specialty Coatings will present on thermally-stable, vapor-phase conformal coating for protection of electronics in harsh environments
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
. Likely solder joint failure modes of interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced and surface cracks will be illustrated
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Aspandiar further argues that during various types of stress testing such as temperature cycling, or mechanical shock and bending, cracks are more prone to initiate and propagate through these near
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Aspandiar further argues that during various types of stress testing such as temperature cycling, or mechanical shock and bending, cracks are more prone to initiate and propagate through these near
