Lewis & Clark | https://www.lewis-clark.com/product/mydata-feeder-large-reel-attachment-l-014-0710/
# L-014-0710 Mydata/Mycronic Feeders Large Reel Attachment -Part# L-014-0710 Call 603-594-4229 For Price Part# L-014-0710 All Feeders come with a 60 Day Warranty
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/valves/square-wave-non-contact-dispense-valve
Nordson EFD | Square Wave™ Non-Contact Dispense Valve | Fluid Dispensing Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/Xpedition.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Expedition.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Pulsonix.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Xpedition.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/Pulsonix.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | https://www.pcblibraries.com/Products/FPX/DipTrace.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | http://www.pcblibraries.com/products/fpx/altium.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/Allegro.asp
– Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow
