Partner Websites: thick gold fingers (Page 1 of 5)

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal

. It was found that the gold would go into solution and create a thick gold intermetallic condition creating fracture condition in solder joints

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

. It was found that the gold would go into solution and create a thick gold intermetallic condition creating fracture condition in solder joints

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

Assembly Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/

Black Blue Red GoldFingers * Gold Finger Plating Thickness No Gold Fingers 10u" 20u" 30u" 50u" Routing Individual Scoring Route/Retain Route/Retain/Scoring Cutouts/Slots

Imagineering, Inc.

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