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Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
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Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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. The above two points are our simple summary of the common defects and treatment methods of SMT reflow soldering. Bridging and wicking are the two most common defects at present
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copper layer on the PCB, test the actual welding temperature at the solder joint Set the temperature curve. 2. Control the preheating time, reflow time, and cooling time
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= 4 minutes Calculate Line Speed: (3 boards/min) x (8 inches/board) 0.8 Line speed = 30 inches/minute Therefore, the reflow oven must have a process speed of at least 30 inches per minute
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., test the actual welding at the solder joint Temperature to set the temperature curve. 2.Control the preheating time, reflow time and cooling time
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= 4 minutes Calculate Line Speed: (3 boards/min) x (8 inches/board) 0.8 Line speed = 30 inches/minute Therefore, the reflow oven must have a process speed of at least 30 inches per minute
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= 4 minutes Calculate Line Speed: (3 boards/min) x (8 inches/board) 0.8 Line speed = 30 inches/minute Therefore, the reflow oven must have a process speed of at least 30 inches per minute
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. The problem with this method is that the choice of the low melting point alloy may be affected by the final product. Due to the limited operating temperature, high melting point alloys will inevitably increase the temperature of reflow soldering, which will cause damage to components and the PCB itself
