| https://www.eptac.com/webinars/plated-through-hole-fill-understanding-the-process-and-assembly-requirements
Plated Through Hole Fill: Understanding the Process and Assembly Requirements - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
: Wave Soldering Insufficient Fill and Voids in PTH There are many reasons for insufficient fill of a PTH (Plated Through Hole) and the occurrence of voids in barrels
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact Soldertip SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH There are many reasons for insufficient fill of a PTH (Plated Through Hole
Blackfox Training Institute, LLC | https://www.blackfox.com/tag/through-hole-soldering-training/
Through Hole Soldering training Archives - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
| https://www.eptac.com/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs/
. More than likely, there is not enough heat or thermal capacity in the solder iron to heat the entire hole up to soldering temperatures, thereby the solder solidifies going up through the hole and that’s it, it doesn’t fill any further
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs
. More than likely, there is not enough heat or thermal capacity in the solder iron to heat the entire hole up to soldering temperatures, thereby the solder solidifies going up through the hole and that’s it, it doesn’t fill any further
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-revision-f-paragraph-7-3-5-1-supported-holes-solder-vertical-fill-a
. The segment of the document that covers the section for less than 14 leads and Class 2 requirements for 50% hole fill due to inner layer heat sinking was left out of the documents, and now in this revision of both 610 and 001, that particular section is missing
