46 time above liquidus tal results

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf

. Research studies show that the peak temperature (PT) and time above liquidus (TAL) during the reflow process are the most critical parameters, impacting solder joints reliability (Arra, 2002; Salam, et al., 2004

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Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

. Research studies show that the peak temperature (PT) and time above liquidus (TAL) during the reflow process are the most critical parameters, impacting solder joints reliability (Arra, 2002; Salam, et al., 2004

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How to Use Reflow Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2020-02-13/13961.chtml

. Does the slurry require a nitrogen (low oxygen) environment during heating? Reflow specifications, including peak temperature, time above liquidus (TAL), etc

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print

. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com:9060/te_news_industry/2021-08-31/23961.chtml

. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/te_news_industry/2021-08-31/23961.chtml

. Soak time and TAL consideration To ensure proper temperature equalization of the whole area beneath the connector, it is recommended that the soak time is long enough as well as the time above

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

 Time above liquidus, 60 – 90 sec and 90 to 120 seconds  Board finish, ENIG and OSP 25 Initial Results  Lower peak temp and shorter TAL did not result in acceptable solder joints 26 Results

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

next year, further work will focus on: The impact of multiple subsequent reflows and profiles (including lower peak temperatures) on void rates Improving fixturing to give more consistent wetting near die edges Optimizing the time above liquidus (TAL

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