| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
:20 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml
:16 Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad (from hot air leveling or other pcb solder-coating method
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| http://etasmt.com/cc?ID=te_news_bulletin,18961&url=_print
. The main components of general tin-lead solder are tin and lead, which are relatively low in strength. So in order to increase its strength as much as possible, we are soldering Usually need to increase the welding area according to the actual situation, or use it for the lead of the component to be welded
| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print
. The main components of general tin-lead solder are tin and lead, which are relatively low in strength. Therefore, in order to increase its strength as much as possible, we are soldering Usually need to increase the welding area according to the actual situation, or use it for the lead of the component to be welded
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
