| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Activator cleans metal surfaces of oxides and contaminants, promoting wetting of Solder Alloy. Activator is consumed by heat over time
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Activator is consumed by heat over time. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
dominant. The reaction for indium oxide is suspected to be similar to that of tin oxide. The resultant indium formate is eliminated through sublimation. VI. CAUSES OF VOIDING Several types of solder voids have been noted [14], most of which are related to
| https://www.eptac.com/solder-tips/
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips?hsLang=en
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/faqs/soldertips
: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution
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