Partner Websites: tin plating whisker (Page 1 of 10)

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads

: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/

: This is a very interesting question regarding the reflow of immersion tin plating. I’ve found and attached this web site that discusses this particular issue. http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4684411&url=http%3A%2F%2Fieeexplore.ieee.org%2Fstamp%2Fstamp.jsp%3Ftp%3D%26arnumber

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

. Although gold is a noble metal, the methodology for its application, be it electroplating or immersion plating, gold will still go into a molten tin/lead or tin solder solution

Thermaltronics M7BVF010H Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m7bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/

: Thermaltronics Description Additional information Description Thermaltronics M7BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating

Thermaltronics M8BVF010H Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m8bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/

: Thermaltronics Description Additional information Description Thermaltronics M8BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating

Thermaltronics M6BVF010H Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m6bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/

: Thermaltronics Description Additional information Description Thermaltronics M6BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating

Thermaltronics M6BVF060H Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m6bvf060h-bevel-45deg-6-00mm-0-24-tin-area-face-only-power-plus/

: Thermaltronics Description Additional information Description Thermaltronics M6BVF060H Bevel 45deg 6.00mm (0.24″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating

Thermaltronics M8DS526H Metcal STTC-SMTC Compatibility

| https://pcbasupplies.com/thermaltronics-m8ds526h-knife-4-50mm-0-177-increased-tin-area-6-1mm-0-24-power-plus/

: Thermaltronics Description Additional information Description Thermaltronics M8DS526H Knife 4.50mm (0.177″), Increased Tin Area 6.1mm (0.24″), Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

. Some candidates are described below. Pure Tin.  Tin has good wettability/solderability over a large range of substrates, making it an excellent choice for lead finish through tin plating

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