| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| https://www.eptac.com/faqs/ask-helena-leo/page/6
. All references, both personal, professional, and relative to product details will be removed from the discussion. Will I Damage a Wire-In-Board if it is Bent Too Far QUESTION Question
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| https://www.eptac.com/faqs/ask-helena-leo/ask/charring-of-wire-insulation
: We have an ongoing debate regarding the charring of wire insulation. IPC-A-610E is very clear on the topic. Aside from overheating damage to the PCB, what other dangers does this pose
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. In 2006, the European Union banned certain hazardous substances in electronic products, including lead. In the past two decades, the electronic manufacturing world has experienced a dynamic development of alternative soldering material centered on tin metal, with manufacturers switching to lead-free
| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
. Method and specific role. 1. The role of reflow oven preheating zone Preheating is to activate the solder paste, and to avoid the rapid high temperature heating during the immersion tin, which is the heating action performed to
| https://www.eptac.com/faqs/ask-helena-leo/page/4
? Also, how do you avoid bubbles in the coating? Read More Vapor Phase Soldering to Immersion Tin Plated Pads QUESTION Question: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process
.png)
