80 tin thickness results

Vapor Phase Soldering to Immersion Tin Plated Pads - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/

. The characterization of the thin oxide layers were studied by using high resolution analysis methods as XPS, TEM, and SERA. The results proved a thickness of immersion tin oxide layers at approximately 7 nm by TEM and XPS analysis after plating

. •  Institute a one touch soldering process •  Watch the plating thickness of tin and tin/ lead coating on the boards as this can be a problem area if the coating is too thin

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max

Imagineering, Inc.

SolderTips: Solderability Issues with Nickle Plated Surfaces | EPTAC

| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

2.54 µm [100 µin] or more of gold thickness –  From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

H910 Off-line AOI Automated PCB Optical Inspection Machine_Shenzhen Honreal Technology CO.,Ltd.

| http://www.szhonreal.com/productview.asp?id=37

< 100 ms Testing content The printing Whether, skewed, tin much less tin, open circuit, pollution Parts defects Lack of parts, migration, askew, made a, side made, turn over the pieces, polarity, wrong

[N1D2D3] be removed: a.  From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 µm [100 µin] or more of gold thickness b.  From 95

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf