| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-pcb-finish/
. The materials you use during fabrication will impact this as much as the finish. Immersion silver, immersion tin, and OSP finishes are, as a rule, more prone to breaking when not properly held
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
Leaded vs. Lead-Free Solder: Which is Better? Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
September, 2015 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Gold and electronics have
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/
• Inner Layer - 10 oz • Inner Layer - 16 oz Buried/Blind Via 10+N+10 (HDI) Plasma Desmear Yes Outline Tolerance +/-.004 Surface Finish • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG Impeadance Control
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Class 2 vs Class 3 Assemblies SolderTip #40: Component Mounting and Acceptability Question: We are working with components with leads of tin/lead over nickel
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/
* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL
