Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Yi Abstract 2016 29-3 Thermal Mechanical Fatigue of a 56 I/O Plastic Quad-Flat Nolead (PQFN) Package M. Neilsen and P. Vianco Abstract 29-3 Validated Solder Coverage for Tin Whisker Mitigation of 0402 Ceramic Capacitors
ASCEN Technology | https://www.ascen.ltd/conformal_coating/597.html
environments.Materials are available for tin whisker mitigation, humid environments, and shadow areas.Robotic PCB conformal coating spray machine connect the PCB UV light conveyor greatly streamline printed circuit board
ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/597.html
environments.Materials are available for tin whisker mitigation, humid environments, and shadow areas.Robotic PCB conformal coating spray machine connect the PCB UV light conveyor greatly streamline printed circuit board
| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf
” 4 J-STD-001/610 • Tin mitigation plan according to GEIA- STD-0005-2 will be necessary, or have some plan identifying how it is being handled by the industry • The question is
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Vacuum Applications Show Details Key Advances in Void Reduction New advances in the reflow soldering process includingvacuum technology and warpage mitigation systems Show Details Component Cracking
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
? Bob Wettermann Free! 2018 Tin Whisker - All You Should Know Dr. Jennie S. Hwang $200.00 2018 Stencil Printing Process and Solder Paste Inspection – An In-Depth Look S
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
Storage Hardware" 2014: Polina Snugovsky, Ph.D., Celestica Inc., and Stephan Meschter, Ph.D., BAE Systems "Strategic Environmental Research and Development Program Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies" 2013: You Chye How
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
. Evaluation of Tin Whisker Formation of Discrete Capacitor Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage Andre Delhaise, Ph.D., Celestica, Inc