20 tin whisker mitigation results

., Francy John Akkara, Cong Zhao, Sudan Ahmed, Mohammed Abueed, Sinan Su, Jeffrey Suhling, *Pradeep Lall, Ph.D., Auburn University Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage *André Delhaise, Ph.D., Celestica, Inc

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

., Francy John Akkara, Cong Zhao, Sudan Ahmed, Mohammed Abueed, Sinan Su, Jeffrey Suhling, *Pradeep Lall, Ph.D., Auburn University Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage *André Delhaise, Ph.D., Celestica, Inc

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness - EPTAC - Train. Work S

| https://www.eptac.com/ipc-medical-industries-technical-conference-lead-free-reliability-readiness/

: Reliability Priorities for Lead-Free Dr. Peter van der Heide, Sr. Director of Product Creation Process – Philips Healthcare 9:00 am          Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist

Call for Participation: Technical Paper | IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-technical-paper-form

) Process Surface Preparation Methods Vapor Phase Warpage-induced Defect Mitigation Other… Enter other… Circuit Design and Component Technologies Topics

Call for Participation | IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-participation

) Test Method Developments Tin Whiskers Enabling Future Technologies Microminiaturization  Nanotechnology  E-textiles and Smart Textiles Energy Harvesting Flexible Hybrid Electronics Graphene in Electronics Manufacturing LED Manufacturing Optoelectronics Photovoltaics Sensors and Haptics Wearables Meeting

IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness

| https://www.eptac.com/blog/ipc-medical-industries-technical-conference-lead-free-reliability-readiness

: Reliability Priorities for Lead-Free Dr. Peter van der Heide, Sr. Director of Product Creation Process – Philips Healthcare 9:00 am          Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist

Professional Development Courses | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm

alloys with high reliability and reduced fragility will be presented. Electromigration and tin whisker will also be discussed. PDC07     Embedding Passive and Active Components PCB Design, Fabrication Methodologies and Assembly Process Strategy Cancelled

Surface Mount Technology Association (SMTA)

The 5 Essential Tools for Soldering

| https://www.eptac.com/blog/the-5-essential-tools-for-soldering

. It is the joining process used to fuse different types of metals together by melting solder. Solder is a metal alloy usually constructed of tin and lead and is melted by using a hot iron

Page 9 – EPTAC – Train. Work Smarter. Succeed

| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/9/

. Director of Product Creation Process – Philips Healthcare 9:00 am          Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist – H&L Instruments 9:45 am           PERM (Pb-free Electronics Risks Management) Status Report Anthony