15 tin whisker mitigation in assembly results

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

. Abstract 32-2 The Study of Dissolution of Bi Precipitates in Sn Using a Novel In Situ Heating Technique in the SEM Peter Banh, André M. Delhaise, Doug D. Perovic Abstract 32-2 Tin Whisker Formation in Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage, Part I

Surface Mount Technology Association (SMTA)

. Table 7-10 also discusses the Test protocols for Pb-free soldering Table 7-12 Tin Whiskers Mitigation 17 Section 7 Assembly and Joining Materials 18 Section 7 Assembly and Joining Materials 19

| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf

Download Webinars/Webtorials On-Demand

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm

?   Bob Wettermann  Free! 2018  Tin Whisker - All You Should Know   Dr. Jennie S. Hwang  $200.00 2018  Stencil Printing Process and Solder Paste Inspection – An In-Depth Look   S

Surface Mount Technology Association (SMTA)

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

: Robert Darveaux, Amkor Technology "Mechanical Testing of Solder Joint Arrays Versus Bulk Solder Specimens" 2005: Julia Y. Zhao, Analog Devices "A Study of the Failure Mechanisms in Lead-free and Eutectic Tin-lead Solder Bumps for Flip Chip Assembly" 2004

Surface Mount Technology Association (SMTA)

, “Assembly Induced Defects” by John Maxwell Flex Mitigation Try to avoid placing capacitors in: •  Close proximity to connectors and rigid fixtures

| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf

ICEET Program

Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf

. Evaluation of Tin Whisker Formation of Discrete Capacitor Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after Long-Term Ambient Temperature, High Humidity Storage Andre Delhaise, Ph.D., Celestica, Inc

Surface Mount Technology Association (SMTA)

(CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder Joints Timo Herberholz, , Robert Bosch GmbH

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

(CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder Joints Timo Herberholz, , Robert Bosch GmbH

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

robotic conformal coating spray solution-PCB magazine loader,PCB turn conveyor,pcb conformal coating

ASCEN Technology | https://www.ascen.ltd/conformal_coating/597.html

environments.Materials are available for tin whisker mitigation, humid environments, and shadow areas.Robotic PCB conformal coating spray machine connect the PCB UV light conveyor greatly streamline printed circuit board

ASCEN Technology

Call for Participation: Technical Paper | IPC APEX EXPO 2021

| https://ipcapexexpo.org/education/call-for-technical-paper-form

) - Select - Assembly Processes Circuit Design and Component Technologies Conscientious Engineering Enabling Future Technologies Electronics Materials Factory of the Future Implementation Meeting