11 tin-lead solder paste mixiong with sac305 results

Microsoft Word - pan_APEX06.doc

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf

). Figure 2 shows a sample lead-free reflow profile. Figure 2. A sample lead-free reflow profile Since it is a 32 factorial design with three replications, 27 boards were assembled using SnPb paste and 27 boards were assembled using SAC305 paste

Heller Industries Inc.

= the ability of an item to be soldered –  With a through hole lead, the solder would wick up into the pth. Solder mask Multi-layered Through-hole pcb 9 Visual Method Classification 1.3.1 (1.5.1

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_04_18_12.pdf

Best Papers - Award Winners | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm

: Hersh Kohli, Motorola, Illinois "E-Manufacturing Software for Product and Process Real-Time Monitoring" 2000: Andrew Mawer, Motorola SPS, Texas "Automotive PBGA Assembly and Board-Level Reliability with Lead-Free Versus Lead-Tin Interconnect" 1999

Surface Mount Technology Association (SMTA)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

Kim Abstract 14-1 AUTOMOTIVE PBGA ASSEMBLY AND BOARD-LEVEL RELIABILITY WITH LEAD-FREE VERSUS LEAD-TIN INTERCONNECT Andrew Mawer Abstract 14-1 EFFECT OF THERMAL CYCLING RAMP RATES ON SOLDER JOINT FATIGUE LIFE V.Srirama Sastry Abstract 2000 13-4 EFFECTS

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys

Heller Industries Inc.

., Francy John Akkara, Cong Zhao, Sudan Ahmed, Mohammed Abueed, Sinan Su, Jeffrey Suhling, *Pradeep Lall, Ph.D., Auburn University Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage *André Delhaise, Ph.D., Celestica, Inc

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

., Francy John Akkara, Cong Zhao, Sudan Ahmed, Mohammed Abueed, Sinan Su, Jeffrey Suhling, *Pradeep Lall, Ph.D., Auburn University Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity Storage *André Delhaise, Ph.D., Celestica, Inc

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Webinars

Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/

(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied

Surface Mount Technology Association (SMTA)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

(SAC105, SAC305, matched solder sphere - paste) with Bi-based solder pastes on the component reliability in accelerated thermal cycling is studied

Surface Mount Technology Association (SMTA)