| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
. Tinning is sometimes done with a noble metal such as gold to improve the adhesion of bond wires. The problem is that some molding compounds do not adhere well to the noble metals
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/faqs/ask-helena-leo/page/5
: Are there any references or materials I can look at or download specific to Lead-Free Soldering? Read More Gold Wire Bond Failing Pull Test QUESTION Question
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
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