| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1058-lead-delaminations
. Gating includes the lead frame, paddle and die surface. Result The unusually symmetrical pattern of the delaminations (red) of the molding compound from the leads is probably caused by incompatible tinning of the leads
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
