| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. More SolderTips Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Have a question about training or IPC certification
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Question: Regarding gold removal requirement under Section
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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