| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly. Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/controlflow-solder-nozzles
Related Information Datasheets ControlFlow Solder Nozzles Datasheet - English ControlFlow Solder Nozzles Specially Designed to Reduce Dross Formation and Eliminate Solder Ball Features and Benefits - ControlFlow nozzles greatly reduce dross creation and eliminate formation of
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options
. Fully compatible with MicroDrop drop-jet flux dispenser to verify… ControlFlow Solder Nozzles ControlFlow nozzles greatly reduce dross creation and eliminate formation of solder balls during the selective soldering process
ASCEN Technology | https://www.ascen.ltd/optical_inspection/519.html
. The ASCEN PCB optical inspection machine enables faults to be detected as soon after the manufacture process as possible. AOI, automatic optical inspection machine use visual methods to monitor printed circuit boards for defects
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. If this condition occurred during a wave or reflow soldering process, then this points to underlying process issues. With wave soldering, if there is excessive solder flow up through the holes, this may indicate the possibility that the board is traveling too slowly in the process
ASCEN Technology | https://www.ascen.ltd/optical_inspection/512.html
soldering paste, which is made of tin particles and flux, to the PCB panel. And let the component be soldered. This full auto SMT PCB screen printer
| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies
. If this condition occurred during a wave or reflow soldering process, then this points to underlying process issues. With wave soldering, if there is excessive solder flow up through the holes, this may indicate the possibility that the board is traveling too slowly in the process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/fluid-coating-systems?con=t&page=6
ControlFlow Solder Nozzles Nordson SELECT ControlFlow nozzles greatly reduce dross creation and eliminate formation of solder balls during the selective soldering process. ProBlue®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent. Wave Soldering A process of soldering
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