| http://etasmt.com/te_news_industry/2021-09-15/26566.chtml
. Multiple heads spindles/manipulators reduce the number of cycles between pick and place allowing axis speed to be less critical to overall assembly rates
| https://www.smtfactory.com/What-are-the-functions-and-uses-of-SAMSUNG-Pick-Place-Machine-id3558478.html
? What is the LED Display SMT Production Process? I.C.T New Product - Selective Soldering Machine & Splicing Machine What is Selective Wave Soldering Machine
| http://etasmt.com:9060/te_news_industry/2013-06-08/4961.chtml
(or other substrate) method is called SMT process. Related assembly equipment is called SMT equipment. SMT features: High density assembly, electronic products small size, light weight, about 1/10 of the chip component size and weight of traditional plug-in component, generally, SMT electronic products volume is reduced from 40% to 60%, weight from 60% to 80
| http://etasmt.com/te_news_industry/2013-06-08/4961.chtml
(or other substrate) method is called SMT process. Related assembly equipment is called SMT equipment. SMT features: High density assembly, electronic products small size, light weight, about 1/10 of the chip component size and weight of traditional plug-in component, generally, SMT electronic products volume is reduced from 40% to 60%, weight from 60% to 80
| http://etasmt.com/cc?ID=te_news_industry,26566&url=_print
. Multiple heads spindles/manipulators reduce the number of cycles between pick and place allowing axis speed to be less critical to overall assembly rates
| http://etasmt.com:9060/te_news_industry/2021-09-15/26564.chtml
& Test What do I need: ICs with more functions Powerful processors Smaller size components High performance components Discussion Established NPI process is essential to the development of new packages and products
| http://etasmt.com/te_news_industry/2021-09-15/26564.chtml
& Test What do I need: ICs with more functions Powerful processors Smaller size components High performance components Discussion Established NPI process is essential to the development of new packages and products
| http://etasmt.com/cc?ID=te_news_industry,26564&url=_print
& Test What do I need: ICs with more functions Powerful processors Smaller size components High performance components Discussion Established NPI process is essential to the development of new packages and products
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23577.chtml
: Vacuum-assisted reflow has been shown to reduce the voids in a solder joint by 99% Vacuum pressure is reduced to 1-5 Torr during liquidous of the soldering process Existing voids escape externally through the solder when a vacuum is applied
| http://etasmt.com/te_news_bulletin/2021-08-31/23577.chtml
: Vacuum-assisted reflow has been shown to reduce the voids in a solder joint by 99% Vacuum pressure is reduced to 1-5 Torr during liquidous of the soldering process Existing voids escape externally through the solder when a vacuum is applied
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