Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as
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