ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/resource-center/thermal-compound-selection-guide
críticas del rendimiento térmico: La conductividad térmica (TC) y la resistencia térmica (TR). En aplicaciones de línea de unión baja, la resistencia
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/resource-center/thermal-compound-selection-guide
μm vastagságú vastag – több mint 250 μm vastagságú Két alapvető fontosságú hőteljesítmény-jellemző van: a hővezető képesség (thermal conductivity – TC) és hővezetési ellenállás (thermal resistance – TR). Vékony kötőréteg esetén alapvetően a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/thermal-compound-selection-guide
) und Wärmewiderstand (Thermal Resistance, TR). Bei Anwendungen mit kleiner Klebschicht ist der Wärmewiderstand für die Leistung am wichtigsten
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• High, at greater than 250 μm There are two critical thermal performance characteristics: Thermal Conductivity (TC) and Thermal Resistance (TR
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dvě klíčové vlastnosti: tepelná vodivost (TC) a tepelný odpor (TR). U aplikací s malou tloušťkou vazební vrstvy je výkon ovlivněn především tepelným odporem. U aplikací s velkou tloušťkou vazební vrstvy je výkon ovlivněn především tepelnou vodivostí. U
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/resource-center/thermal-compound-selection-guide
(TR). Nelle applicazioni con linea di giuntura bassa, la resistenza termica domina le prestazioni. Nelle applicazioni con linea di giuntura alta, la conducibilità
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최상의 써멀 컴파운드를 선택하려면 열 전달 메커니즘과 써멀 컴파운드 층 두께, 접착층 두께가 제품 선택에 어떤 영향을 미치는지에 대한 이해가 필요합니다. 접착층은 세 가지 범주로 나눌 수 있습니다. 낮음, 75μm 미만 중간, 75~250μm 높음, 250μm 초과 두 가지 중요한 열 성능 특성이 있습니다. 열 전도율(TC) 및 열 저항(TR). 낮은 접착층 적용 분야에서는 열 저항이 성능을 좌우합니다. 높은 접착층 적용 분야에서는 열 전도도가