ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding
. Temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=2
. Temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=3
. Temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t
. Temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=1
. Temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems?con=t&page=2
. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis
