| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print
. Trapped gas bubbles increase in size as pressure is reduced Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape Larger bubbles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
Bubbles occur when solvents or air become trapped and can’t escape conformal coating material. The presence of bubbles can lead to long-term product reliability issues including bridging of conductive paths, corrosion of exposed areas, and cracked coating due to temperature changes, shock or vibration
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2271-underfill-voids
. Result The large dark feature is a trapped bubble, or void, in the underfill. Since gating at this depth also includes the bonds of the solder bumps to the chip face, it is possible to see that all bumps have the same appearance
| http://etasmt.com/te_news_bulletin/2021-08-31/23577.chtml
. Trapped gas bubbles increase in size as pressure is reduced Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape Larger bubbles
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23577.chtml
. Trapped gas bubbles increase in size as pressure is reduced Larger bubbles are more likely to collide with other bubbles and ultimately collide with the edge of liquid solder to escape Larger bubbles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0434-pqfp-production-scanning
. The circular gap-type defect pattern surrounding the die is typical of a popcorn crack resulting from the sudden expansion of trapped moisture
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/polymer-valves/3-3-way-valves
. Switching between the two outlet channels is done without pressure variation and without trapped air. Benefits: Elimination of dead spaces prohibits the polymer from degrading and causing product defections
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/062819-how-to-select-the-right-piston-for-your-fluid
. 3 Options to Prevent Piston Bounce When air gets trapped below the piston causing it to separate from the fluid it is known as piston bounce
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
. Lamination parameters are improperly calculated. Foil is improperly distributed. Drill values are incorrect. How to Prevent Lamination Voids The biggest culprit of delamination is when moisture is trapped between layers
