Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. Clouthier, AMTX "SMT Printing Process for Fine and Ultra Fine Pitch" 1996: Dr. Randy D. Schueller, 3M, Electronic Products Division "Reliability Results For A Wire Bondable Tape Ball Grid Array Package (TBGA)" 1995: Thomas S. Tarter, AMD; Martin P
| http://etasmt.com/te_news_industry/2013-03-23/3361.chtml
. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Lewis & Clark | https://www.lewis-clark.com/shop/page/12/
HYDRA Fine Pitch Includes (2) 2014 Electro Design Rear Conveyors Condition: Complete & Operational – Extremely Low Usage Hours – Under 550 Location & Shipment: USA /FOB Origin Sold
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/applicators?page=5
. Need an airless solution or a system that reduces maintenance? Our airless industrial spray gun models deliver fine atomization and maximum reliability in high-production, and our automated cleaning system clears out coating nozzles without stopping your process
Lewis & Clark | https://www.lewis-clark.com/shop/page/3/
” Vertical Alignment Upward Vision Camera for Fine Pitch Components and BGA Ball Inspection Max Feeder Capacity: (120) 8mm Feeders (Feeders available separately
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
, S28-02, 2011. 11. IPC, Design and Assembly Process Implementation for BGAs, IPC-7095 Standard, August, 2000. 12. J. Lau and Y.Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, ISBN 0-07-036648-9, McGraw Hill, 1997. pp
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Nanomaterial Surface Finishes for Assembly of Printed Circuit Boards for High Reliability Applications Gregory Morose, et al. Abstract 22-4 ELECTROLESS Ni/Pd/Au PLATING FOR PACKAGE SUBSTRATES WITH FINE PITCH WIRING Yoshinori Ejiri, et al. Abstract 22-4 ACHIEVING