GPD Global | https://www.gpd-global.com/news-events-pr-488.php
. For products that have multiple sizes of components to be underfilled, it can be difficult to program an optimized routine. The difficulty surrounds the timing of each pass to ensure an optimal flow time. The FLOware®
GPD Global | https://www.gpd-global.com/underfill-process-software.php
. For products that have multiple sizes of components to be underfilled, it can be difficult to program an optimized routine. The difficulty surrounds the timing of each pass to ensure an optimal flow time. The FLOware®
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4717
of the SnPb/SAC305 interconnections but reduced that of the 100% SAC305 solder joints. When underfilled, the 100% SAC305 joints exhibited two failure modes: a “low η
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/aci-workshops-june-2013
. Application of underfill fluids at the different interconnect levels can vary, depending upon interconnect density and gap between the surfaces to be underfilled
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
. If the substrate reaches the operating temperature, heat is removed and the substrate is transported to the work area. The work area also has an optional TempView Imaging System to monitor all areas to be underfilled
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
. If the substrate reaches the operating temperature, heat is removed and the substrate is transported to the work area. The work area also has an optional TempView Imaging System to monitor all areas to be underfilled
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
. If the substrate reaches the operating temperature, heat is removed and the substrate is transported to the work area. The work area also has an optional TempView Imaging System to monitor all areas to be underfilled
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