| https://www.eptac.com/ask/soldering-covers-to-a-housing/
: We are soldering a cover to a housing and I was not able to find any quality criteria for the amount of solder flowing down the inside of the housing wall
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-solutions-for-splay-defects
mixing action will provide excellent melt quality An Xaloy ® free-flowing, non-return valve will help produce parts free of defects No matter what resin you are processing for your injection molded components, Nordson offers an Xaloy ®
Lewis & Clark | https://www.lewis-clark.com/product/2010-ekra-x4-screen-printer/
2010 EKRA X4 Screen Printer - Lewis and Clark Skip to content My Cart: $ 0.00 0 View Cart Checkout No products in the cart. Subtotal: $ 0.00 View Cart Checkout Lewis and Clark We Discover Equipment Opportunities 603-594-4229 sales
| https://www.eptac.com/soldertips/soldertips-soldering-with-butane-soldering-irons/
(prevents solder from flowing) and oxidizing the base material. The insulation is a more important issue. I would say the Teflon insulation is OK, but the plastic ones I would say no to, as it will melt
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-appsol-flipchipassembly.php
process consists of dispensing a void-free fluid to encapsulate the bottom side of a silicon die or BGA device. Encapsulation covers the top surface, typically where fragile interconnects are located, but in the case of Capillary Underfill, the fragile interconnects are located on the underside of the component
GPD Global | https://www.gpd-global.com/fluiddispense-appsol-flipchipassembly.php
process consists of dispensing a void-free fluid to encapsulate the bottom side of a silicon die or BGA device. Encapsulation covers the top surface, typically where fragile interconnects are located, but in the case of Capillary Underfill, the fragile interconnects are located on the underside of the component
GPD Global | https://www.gpd-global.com/capillary-underfill-dispensing.php
process consists of dispensing a void-free fluid to encapsulate the bottom side of a silicon die or BGA device. Encapsulation covers the top surface, typically where fragile interconnects are located, but in the case of Capillary Underfill, the fragile interconnects are located on the underside of the component
KD Electronics Ltd. | http://www.kundasmt.com/?OTHER-EQP/5972.html
: Patented Underside Dot Technology Fluid-Flow Vision System™ Cure in Place Technology (UV only) Exclusive PVA Portal Programming Interface 上一篇： HOTFLOW 3/20 下一篇
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-soldering-with-butane-soldering-irons
(prevents solder from flowing) and oxidizing the base material. The insulation is a more important issue. I would say the Teflon insulation is OK, but the plastic ones I would say no to, as it will melt
| https://www.eptac.com/soldertip/soldertips-soldering-with-butane-soldering-irons/
(prevents solder from flowing) and oxidizing the base material. The insulation is a more important issue. I would say the Teflon insulation is OK, but the plastic ones I would say no to, as it will melt
