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: ¹ Physics and Materials Science Binghamton University, ² Universal Instruments Corporation, ³ IBM Corporation (now GlobalFoundries), 4 Corning Inc., 5 Ford Motor Company Date Published
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>> SMT Technical Low Force Placement Solutions for Advanced Packaging There are some inherent limitations of traditional low force method that is increasingly prevalent as bump I/O count and overall
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: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5184 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Mar 2012 at 10:48am Please send me a private message "off-line" or if you know my email address and I will send you the list of Component Manufacturer's and the 2 - 3 character code
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. As the president of PCB Libraries, Inc. I surrounded myself with everything metric and I burned all knowledge of the Imperial unit system
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Placement Solutions for Advanced Packaging From: Author:Mark Hardy Publish time:2021-09-15 13:53 Clicks:2 There are some inherent limitations of traditional low force method that is increasingly prevalent as bump I/O count and overall package size became progressively smaller