39 unsupported holes results

Defects: Lead Protrusion & Damaged Pins - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/webinars/defects-lead-protrusion-damaged-pins/

. This session will review issues related to lead protrusion in both supported and unsupported holes and what is considered acceptable or a defect

Defects: Lead Protrusion & Damaged Pins | EPTAC

| https://www.eptac.com/webinar/defects-lead-protrusion-damaged-pins/

& Damaged Pins Questions always arise about how much lead protrusion is enough or too much. This session will review issues related to lead protrusion in both supported and unsupported holes and what is considered acceptable or a defect

? 5 IPC-A-610 Criteria 7.4.3 Unsupported Holes 6 IPC-A-610 Criteria 7.5.3 Supported Holes 7 Example of Lead Protrusion Lead to hole size ratio. Hole should be: .006” (0,2mm) to .015” (0,4mm

| https://www.eptac.com/wp-content/uploads/2007/12/webinar_eptac_12_19_07.pdf

Webinars - EPTAC - Train. Work Smarter. Succeed (8)

| https://www.eptac.com/webinars/page/8

: 29 Minutes Questions always arise about how much lead protrusion is enough or too much. This session will review issues related to lead protrusion in both supported and unsupported holes and what is considered acceptable or a defect

Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More | EPTAC

| https://www.eptac.com/webinar/hot-topics-solder-mask-bubbles-and-mask-flaking-solder-balls-rohs-cable-coating-and-more/

. Topics we will be reviewing are: Solder balls within unsupported location holes and interference. Conductor width and exposed base material acceptability

Where do Blow Holes in Solder Joints Come From? 1 2 Blow Holes and voids •  Differences – Blow holes/Pin holes – Internal voids in the solder joint 3 Explanations

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_03_14_12.pdf

Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC

| https://www.eptac.com/webinars/hot-topics-solder-mask-bubbles-and-mask-flaking-solder-balls-rohs-cable-coating-and-more/

. Topics we will be reviewing are: Solder balls within unsupported location holes and interference. Conductor width and exposed base material acceptability

Hot Topics: Solder Mask Bubbles and Mask Flaking, Solder Balls, RoHS Cable Coating and More - EPTAC

| https://www.eptac.com/webinars/hot-topics-solder-mask-bubbles-and-mask-flaking-solder-balls-rohs-cable-coating-and-more

. Topics we will be reviewing are: Solder balls within unsupported location holes and interference. Conductor width and exposed base material acceptability

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CIS.pdf

• Acceptance Criteria Externally Observable Characteristics • Board Edges • Base Material Surface and Subsurface • Solder Coatings and Fused Tin Lead • Holes

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_600-CIT.pdf

• Base Material Surface and Subsurface • Solder Coatings and Fused Tin Lead • Holes–Plated Through and Unsupported • Printed Contacts • Marking • Solder Mask • Pattern Definition