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). Over time, as this intermetallic layer grows thicker, it becomes the Achilles Heal of the solder joint in terms of integrity. Depending upon the stresses imposed on the assembly and the solder joints, this is what usually ultimately leads to joint cracking and failure
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Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth
). Over time, as this intermetallic layer grows thicker, it becomes the Achilles Heal of the solder joint in terms of integrity. Depending upon the stresses imposed on the assembly and the solder joints, this is what usually ultimately leads to joint cracking and failure
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) under a variety of material combinations and aging conditions and how those IMCs affect the reliability. The failure modes, thermal cycling reliability, and fragility of solder joints as a function of material combination, thermal history, and stress history will be addressed in details, and novel
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