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. To address this issue the flux has to be more active and have the ability to not break down at vapor phase reflow temperatures. I would suggest getting in touch with the solder paste manufacturer and evaluating a more robust flux material in the solder paste rheology composition
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vapor phase reflow soldering. The reason for such defects is usually caused by the fact that the thermal conductivity of the relevant component leads is too high, and the temperature rises too fast, which causes the upturn of the
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