| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. Common defects and treatment methods of SMT reflow soldering: bridging Bridging can be said to be one of the most common defects. If a bridge defect occurs, it may cause a short circuit between device components
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
enters the process chamber with inert atmosphere Formic acid vapor is introduced into the process chamber Product is heated above the solder liquidous temperature Product is cooled and exits the tool
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. It robs solder from the interconnection, and is usually caused by uneven heating between the materials being joined. This is seldom observed in convection dominant reflow and was more a trait in older IR dominant reflow and vapor-phase technologies
Heller Industries Inc. | https://hellerindustries.com/formic-reflow/
Flux-Free Formic Reflow Soldering - Heller Home » Flux-Free Formic Reflow Soldering Fluxless/Formic Reflow Ovens Heller has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering
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. Cooling air from outside the oven cools the external surfaces of the condenser tubes. The flow direction of the cooling air is opposite the direction of the flux vapor flow to provide the most efficient cooling
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24961.chtml
; permitting a minimum amount of flux vapor from escaping into the customer’s plant exhaust system. Remaining cooled and dilute flux vapor passing through the cooling modules is ducted directly into the
| http://etasmt.com/te_news_bulletin/2021-09-02/24961.chtml
; permitting a minimum amount of flux vapor from escaping into the customer’s plant exhaust system. Remaining cooled and dilute flux vapor passing through the cooling modules is ducted directly into the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
| http://etasmt.com/te_news_bulletin/2021-09-02/24761.chtml
. Cooling air from outside the oven cools the external surfaces of the condenser tubes. The flow direction of the cooling air is opposite the direction of the flux vapor flow to provide the most efficient cooling
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