PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml
) is covered with solder mask. Mask Plugged Via: for this specific measures are taken to ensure the via is plugged and sealed with mask and the annular ring is covered
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html
. Solder Mask Covered: a pad or via (via tenting) is covered with solder mask. Mask Plugged Via: for this specific measures are taken to ensure the via is plugged and sealed with mask and the annular ring is covered
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1596&OB=ASC.html
. Solder Mask Covered: a pad or via (via tenting) is covered with solder mask. Mask Plugged Via: for this specific measures are taken to ensure the via is plugged and sealed with mask and the annular ring is covered
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-guidance-request-from-tim-c_topic538.xml
current capacity. Via holes are typically plugged when using via-in-pad technology and this includes via-in-thermal pad for QFN's
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic538&OB=ASC.html
for calculating trace widths and via sizes for optimizing current capacity. Via holes are typically plugged when using via-in-pad technology and this includes via-in-thermal pad for QFN's
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: A total of 21 of 40 test vehicles had a void greater than 45% of solder ball diameter or 20% of ball area Solder crack path typically found at solder joint / BGA package interface Via in Pad (VIP
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/0402-capacitors-under-1-mm-pitch-bga_topic695_post2385.html
. I would go for the via-in-pad with plugged via. You can see where the Rounded Rectangle pad shape passes DRC clearance checks. Cap the via-in-pad with surface finish, planerize flat
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic695&OB=ASC.html
. I would go for the via-in-pad with plugged via. You can see where the Rounded Rectangle pad shape passes DRC clearance checks. Cap the via-in-pad with surface finish, planerize flat
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