| http://etasmt.com:9060/te_product_j/2022-02-26/19228.chtml
. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2
| http://etasmt.com:9060/te_product_j/2023-02-16/19428.chtml
. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2
| http://etasmt.com/te_product_j/2023-02-16/19428.chtml
. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2
| http://etasmt.com/te_product_j/2022-02-26/19228.chtml
. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Cyclops-II-Vision-Software-InstallUpdateRestore-Guide-22240108.pdf
). How do I verify the vision software install/update/recovery was successful? Test the vision software via the vision processor control panel or by opening a FLOware®
GPD Global | https://www.gpd-global.com/pdf/doc/Cyclops-II-Vision-Software-InstallUpdateRestore-Guide-22240108.pdf
). How do I verify the vision software install/update/recovery was successful? Test the vision software via the vision processor control panel or by opening a FLOware®
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/bubbles-and-conformal-coating
. Joint Industry Standard IPC J-STD-001F – Requirements for Soldered Electrical and Electronic Assemblies When bubbles or voids are present and do not meet the void criteria, they shall be considered process indicators
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Jörg Trodler, Adam Murling Abstract 2018 31-2 Fill The Void III Tony Lentz Abstract 31-2 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: David Hillman, Rockwell Collins "The Last Will and Testament of the BGA Void" 2010: Pradeep Lall, Ph.D., Auburn University "Interrogation of Damage-State in Lead-Free Electrnics Under Sequential Exposure to Thermal Aging and Thermal Cycling" 2009
| https://www.smtfactory.com/I-C-T-LV733-LV-Series-Vacuum-Reflow-Oven-Machine-pd44543571.html
. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2
