ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/bkg-automated-venting
. When the cavity moves back into the inlet flow channel after the filter change, two main concerns can arise: 1. Air Bubbles: It is important that no air is trapped in the cavity
Heller Industries Inc. | https://hellerindustries.com/low-void-curing/
. Bubbles in UF dissolve as pressure is increased. Board Residual gas bubbles in the curing medium are dissolved as pressure increases
supposed to be online for the IPC-A-600H CIS Training Program. Do you know the direct link or where I can find it? Read Answer Air Bubbles or Voids in Solder Joints Question: We did some cross sectioning of solder joints on a PCB assembly and found some air
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-solutions-for-splay-defects
in the resin causing the development of steam Air entrapment leading to bubbles in the part General approaches to help reduce the splay defects in your parts Reduce temperature to prevent gas volatilization Use a dryer to eliminate moisture from resins Lower backpressure Lower screw speed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/events/ipc-apex-expo-2017
. Additionally, material characteristics such as viscosity, needle drip, and outgassing of air bubbles present similar process challenges. Nordson ASYMTEK’s Heakyoung Park will host a panel discussion with industry experts
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/conformal-coating-mechanisms
. If the coating material is not cured properly, shrinkage, orange peel effect, solvent entrapment, or the formation of bubbles can occur
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. They include improved controls for interior air velocity, combined with the surface tension of solder paste, to hold bottom-side components in place and to eliminate the possibility of blowing the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
. They include improved controls for interior air velocity, combined with the surface tension of solder paste, to hold bottom-side components in place and to eliminate the possibility of blowing the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/00600-248-1.pdf
. They include improved controls for interior air velocity, combined with the surface tension of solder paste, to hold bottom-side components in place and to eliminate the possibility of blowing the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Polymers have limited thermal carrying capability since the conductive pathways are via low frequency vibrations of C-C bonds. These phonon modes are at the opposite end of the spectrum from thermally conductive ceramic powders that are used to increase bulk conductivity
