Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
. Removal of process residues is a common practice to reduce electrochemical interactions. The use of miniaturized components may violate minimum electrical clearance for devices exposed to harsh environments
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
PCB’s.There are two things that are important here:IPC-J-STD-001 does not mention any minimum Toe Goal solderfillet.The only comment for the Toe is that the Terminal Lead doesnot hang over the pad to violate the minimum electrical clearance. The
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10535.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2587&OB=DESC.html
PCB’s. There are two things that are important here: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-gull-wing-leads-and-solder-joints_topic2587_post10857.html
: IPC-J-STD-001 does not mention any minimum Toe Goal solder fillet. The only comment for the Toe is that the Terminal Lead does not hang over the pad to violate the minimum electrical clearance. The B dimension