Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
°C, 10 minute dwells, 10 minute ramps, 1000+ cycles Investigation Conclusion: Typical void size was range was 0-65% of X-ray image area
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Vacuum-assisted reflow with convection heating utilizes continuous operation thermal profiles for low COO and high UPH. Recent customer installation showed 10X reduction in voids, meeting specification of <1% total void area
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Vacuum-assisted reflow with convection heating utilizes continuous operation thermal profiles for low COO and high UPH. Recent customer installation showed 10X reduction in voids, meeting specification of <1% total void area
| http://etasmt.com/cc?ID=te_news_bulletin,23577&url=_print
Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Key Advances in Void Reduction Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores new advances in the reflow soldering process
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23577.chtml
%. Another key area to be discussed is the maximizing of the unit per hour (UPH) ofthe system while still achieving the void rate reduction < 1
| http://etasmt.com/te_news_bulletin/2021-08-31/23577.chtml
%. Another key area to be discussed is the maximizing of the unit per hour (UPH) ofthe system while still achieving the void rate reduction < 1
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
| http://etasmt.com/cc?ID=te_news_bulletin,23578&url=_print
% total void area Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification All pressures tested < 20 Torr met <1
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