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Key Advances in Void Reduction-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Key Advances in Void Reduction Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores new advances in the reflow soldering process
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temperature zones. The conveyor speed was 102 cm per minute with a standard air atmosphere environment. The oven used the high convection setting, and the boards were placed on the rails. 167 The test vehicles were allowed to air cool after reflow and then
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
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