Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum This paper explores
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
I.C.T-LV733 How to solve the problem of void, there will be use vacuum reflow soldering machine. Soldering in vacuum environment can fundamentally solve the oxidation of solder in non-vacuum environment, and due to the effect of internal and external pressure difference of solder joint, the
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-lamination-voids-in-pcb-manufacturing/
Close Search What Are Lamination Voids in PCB Manufacturing? By Behind the Work June 16, 2022 September 21st, 2023 Blog , Industry News No Comments Lamination voids, also known as delamination, are a problem that can occur in the printed circuit board manufacturing process
Heller Industries Inc. | https://hellerindustries.com/tombstoning/
the component Reflow-related causes of Tombstoning in PCB Soldering: Improper pad design may be aggravated by use of nitrogen. The nitrogen increases surface tension of the metals to the extent that a previously marginal problem becomes distinct
| https://unisoft-cim.com/installation_full-install.html
. Any misuse may void the license. By installing or otherwise using the Unisoft software you agree to be bound by the terms of the current Unisoft End-User License Agreement (EULA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. Yeah, so what? Is it a problem? Can you prove that it is a problem? Do you have data backing up your claim? Or is it just that they are there and we don’t want them? Man, am I glad
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/products/acoustic-inspection-systems/j610
minor adjustments as needed. In its auto made the tool can automatically analyze each image. For example, if it detects a void in a die attach layer, software measures the area of the void as a percentage of the whole die attach area
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
? They are finding some! Wow. Isn’t that something? That’s like looking at Swiss cheese and saying there are voids in the cheese. Yeah, so what? Is it a problem? Can you prove that it is a problem
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
. In this case, the replacement guarantee is void. What if the paste gets warmer than recommended storage temperature during shipping
