Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-effect-of-vacuum-reflow-processing-on-solder-joint-voiding-and-thermal-fatigue-reliability/
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability. - Heller Industries Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability 中文 MEMBERS LOGIN Membership Become a Member
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. In Detail BGA Devices - Reflow Inspection and Mechanical Test Left: Accurately measure BGA ball diameter and solder voiding with Quadra 3 and Explorer One . Right
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology
inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality. Check shape, fill level and voiding in TSV through silicon vias
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/dr-evstatin-krastev-from-nordson-dage-to-present-two-ground-breaking-x-ray-inspection-studies
– Impact of Interfacial Voiding.” To date, there have been no quantitative studies trying to explain the impact of interfacial voiding on joint reliability and compare this to the impact of the voiding that is located within the bulk
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-quadra-w8-automated-wafer-x-ray-inspection-system
• Check shape, fill level and voiding in TSV through silicon vias. • Inspect build quality, wire bonds, component alignment and solder
