Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
“The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability” [5] Investigation Specifics: 225 I/O Plastic BGA, daisy chained, 0.762mm (30 mil
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
× The Last Will And Testament of the BGA Void. Post navigation Previous Post Previous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. In Detail BGA Devices - Reflow Inspection and Mechanical Test Left: Accurately measure BGA ball diameter and solder voiding with Quadra 3 and Explorer One . Right
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers-x-ray-inspection
Study of BGA Devices - Impact of Interfacial Voiding Implications of Using Lead Free Solders on X-ray Inspection of Flip Chips and BGAs Investigating Voids - Circuit Assembly Article Does PCB Pad
| https://www.eptac.com/wp-content/uploads/2012/06/eptac_07_18_12.pdf
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/dr-evstatin-krastev-from-nordson-dage-to-present-two-ground-breaking-x-ray-inspection-studies
size and location of the voiding as determined by the Large Board CT. In an effort to achieve good statistical significance, a very large sample of BGA devices mounted on PCBs is utilized
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/jade-plus
. Ensure IPC-A-610 and IPC-7095 compliance with built in checking for BGA and QFN voiding, solder ball diameter, roundness, bridge and missing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-counting-systems?con=t&page=14
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection?page=1
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/applications/test-and-inspection
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
