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3 Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
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. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
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. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
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™ with Nordson DAGE. Automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions
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(US Tech Magazine, July 2012) (PDF 212 KB) Jade Plus Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/metal-fabrication?con=t&page=39
. Jade Plus Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
