ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/maintenance-free-x-ray-inspection-now-available-for-pcba-production-applications
. Quadra 3 is ideal for detecting a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices screening
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/x-ray-inspection-systems?con=t&page=8
3 Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=13
: First Bond Ball/Stud Bump Pull Modern 2D / 3D X-ray Inspection - Emphasis on BGA, QFN, 3D Packages and Counterfeit Components Nordson DAGE 3 Point Bend Fixture Datasheet Nordson DAGE Explorer one
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/x-ray-counting-systems?con=t&page=6
. Available at point of sale or prior to expiry of warranty period. Wafer X-ray Metrology Nordson Corporation Measure the Invisible™ with Nordson DAGE. Our systems provide automatic X-ray measurement of TSVs, MEMS and wafer bumps for voiding, fill level, overlay and other critical dimensions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems?con=t&page=11
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/quadruple-industry-recognition-for-nordson-dage-test-and-inspection-systems-at-nepcon-china-2018
. Inspecting a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening, Quadra 3 is an
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology?con=t&page=11
. Jade Plus Nordson DAGE High quality X-ray inspection for production applications. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-force-pull?con=t&page=10
. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/software?con=t&page=12
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Software Products Content Your results for: Software Investigating Voids - Circuits Assembly article Nordson DAGE Does PCB Pad Finish affect Voiding Levels in Lead-Free Assemblies Nordson DAGE Implications of Using Lead-Free Solders on X-ray
