PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/lga-incorrect_topic2691_post10981.html
. 1. The lands are Rectangular. Only Square or Circle are offered. 2. The pin count in the LGA settings isn't allowing for 4 pins x 2 sides + 3 ins x 2 sides = 14
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2691&OB=DESC.html
: 54 Post Options Post Reply Quote phil.holden Report Post Thanks(0) Quote Reply Topic: LGA Incorrect Posted: 01 Oct 2020 at 8:58am Yes it works in the PQFN category
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2691&OB=DESC.html
: 54 Post Options Post Reply Quote phil.holden Report Post Thanks(0) Quote Reply Topic: LGA Incorrect Posted: 01 Oct 2020 at 8:58am Yes it works in the PQFN category
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2691&OB=ASC.html
. 1. The lands are Rectangular. Only Square or Circle are offered. 2. The pin count in the LGA settings isn't allowing for 4 pins x 2 sides + 3 ins x 2 sides = 14
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1620&OB=ASC.html
Default D-Lead [pad Shape and Dflt.- Lead Pad Shape in the LGA settings screens, where are the default values for these set under preferences
| https://www.eptac.com/ask/problems-with-pcb-micro-voiding/
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
. The true root cause is still under investigation, but a Kirkendall voiding mechanism may play a part. These voids can affect solder joint reliability, particularly in instances when brittle fracture is initiated within the IMC during drop or mechanical hock to the solder joint
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/land-grid-array-lga-different-pin-1-shape_topic177.html
Land Grid Array LGA Different Pin 1 Shape - PCB Libraries Forum Forum Home > PCB Footprint Expert > Product Suggestions New Posts FAQ Search Events Register Login Land Grid Array LGA Different Pin 1 Shape
