Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
@nordsondage.com ABSTRACT The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/products/bga-rework-training
. The lateses processes, materials, equipment and techniques for rework of BGA, QFN, LGA, PoP and other SMD components. Key Topics Include: A review of the parameters for establishing a safe thermal profile
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0419-delaminations-and-voids
. The ultrasonic echoes were gated narrowly on the interface between the two bonded wafers. The purpose was to detect voiding and delamination in the bond between the wafers
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& Place Nozzles Clearance Solder Products Brands Thermaltronics XDry Corp Count On Tools Quantum Storage Systems PCBASupplies BEAU TECH EasyBraid Tronex Koki Categories Hand Soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology/xm8000-wafer-x-ray-metrology-platform
XM8000 Brochure XM8000 Wafer X-ray Metrology Platform Fast Automatic X-ray Measurement of TSVs, MEMS and Wafer Bumps for Voiding, Fill Level, Overlay
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-counting-systems?con=t&page=14
– Impact of Interfacial Voiding Nordson DAGE The Challenges of Package on Package (POP) Devices during Assembly and Inspection Nordson DAGE First
Heller Industries Inc. | https://hellerindustries.com/product/1913-mark-5-series-smt-reflow-oven/
C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements! Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all
Heller Industries Inc. | https://hellerindustries.com/1913-mark-5-series-smt-reflow-oven/
) lead screws ensures the tightest tolerances and parallelism – even on boards with 3mm clearance at the edges! Fastest Cooling Rates The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
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