11 voids enig results

0.47 7 Atmospheric - 7.64 8 5 15 0.48 Test #7 Details-No Vacuum Test #1 w/ 5 Torr for 30 seconds 0.21% worst case voids Results Stencil Design #2 1. QFN “MLF 100” of With Vacuum & Without Vacuum # Type 2 # without Vacuum # with Vacuum ( 5torr 60sec ) Results ENIG ( 20torr / 30sec ) ENIG ( 20torr / 60 sec

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

 Time above liquidus, 60 – 90 sec and 90 to 120 seconds  Board finish, ENIG and OSP 25 Initial Results  Lower peak temp and shorter TAL did not result in acceptable solder joints 26 Results

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations

Heller Industries Inc.

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations

Heller Industries Inc.

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

—the softness of indium makes the surfaces very susceptible to dents, scratches and collecting foreign materials. Any of these incidents can result in voids in the finished sTIM

Heller Industries Inc.

” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold” *George Milad, Jon Bengston and Albin Gruenwald, Uyemura International Corporation Inspection Technologies Refreshment Break Lunch Break Refreshment Break Day One Concludes Women's Leadership Program

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold” *George Milad, Jon Bengston and Albin Gruenwald, Uyemura International Corporation Inspection Technologies Refreshment Break Lunch Break Refreshment Break Day One Concludes Women's Leadership Program

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

.   Drawbridging See Tombstoning .     E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

.   Drawbridging See Tombstoning .     E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint

ASYMTEK Products | Nordson Electronics Solutions

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe

Surface Mount Technology Association (SMTA)