ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-mesoshere-plasma-systems-enable-very-high-throughput-processsing
. Tight control over all process parameters gives highly repeatable results. For wafer cleaning, the MesoSPHERE plasma system removes contamination prior to wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/keynotes.cfm
., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package
| http://etasmt.com/cc?ID=te_news_bulletin,23566&url=_print
(including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/fluxless-reflow-1.pdf
Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-plasma-confinement-ring-increases-etch-rate-improves-treatment-uniformity-for-wafer
Series of plasma systems. Plasma applications include descum, ashing/photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plasma applications include descum, ashing/photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23566.chtml
. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes
| http://etasmt.com/te_news_bulletin/2021-08-31/23566.chtml
. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow Excellent results demonstrated for wafer bumping application in horizontal reflow oven Fluxless reflow utilizes
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package
Heller Industries Inc. | https://hellerindustries.com/semiconductor-advance-packaging/
. Bumping and Die Attach Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes
